Post on Oct 21，2025
Upgraded intellectual property cooperation: AMS Osram signs extensive patent cross licensing agreement with Nichia
Post on Oct 16，2025
SiC JFET enables solid-state circuit breakers (SSCBs) to withstand high temperature conditions without fear
Post on Oct 16，2025
MathWorks upgrades MATLAB desktop experience to improve work efficiency
Post on Oct 16，2025
ROHM develops low VF and low IR Schottky barrier diodes for protection
Post on Oct 16，2025
Vishay's new automotive grade film capacitors have a working temperature of up to+125 ℃ and exhibit high stability under high humidity conditions
Post on Oct 16，2025
Melexis launches its first dual input inductive sensor to serve future automotive electronic systems
Post on Oct 16，2025
Zhaoyi Innovation and Nanrui Jibao have reached a strategic cooperation to strengthen the security foundation of the power chip supply chain
Post on Oct 16，2025
Teradyne launches industry-leading UltraPHY solution, providing comprehensive performance testing for current and next-generation high-speed interfaces
Post on Oct 16，2025
Zhaoyi Innovation and Nano Micro Semiconductor Digital Energy Joint Laboratory Unveiled to Accelerate the Implementation of Efficient Power Management Solutions
Post on Oct 16，2025
How AMS Osram OLED Under Screen Spectral Sensor Reshaps Visual Experience
Post on Oct 16，2025
Da Da Da Da Pin Jia Group launches 1.4kW compressor motor solution based on Infineon products
Post on Oct 16，2025
Achieve ultra-high rated power in the industry! ROHM has developed the UCR10C series of metal sintered shunt resistors
Post on Oct 16，2025
AMS Osram wins Honor "Innovation Quality Assurance Award" for empowering intelligent terminal experience with optical sensing technology
Post on Oct 16，2025
Renesas Electronics uses next-generation power semiconductors to power its 800 volt DC AI data center architecture
Post on Oct 16，2025
Terada launches Titan HP: a groundbreaking system level testing solution that empowers cloud infrastructure and AI chip development
Post on Oct 16，2025
Analog Devices Introduces ADI Power Studio and New Web-Based Tools
Post on Sep 23，2025
ADI collaborates with industry partners to hold a media sharing session on humanoid robots, jointly depicting the future of embodiment
Post on Sep 23，2025
2025 marks the turning point for mass production of humanoid robots, and the innovative full stack chip from Zhaoyi is in place
Post on Sep 22，2025
How to ensure security capabilities in the AI era? AnMou Technology Arm China provides answers to core IP
Post on Sep 22，2025
Technical details of ON Semiconductor's USB-C charging solution
Post on Sep 18，2025
Renesas Electronics' ultra-low power RA0 series adds capacitive touch function MCU
Post on Sep 18，2025
Breaking through the dilemma of embodied intelligence landing, analysis of Ansenmei's core link layout
Post on Sep 18，2025
Dalian United Electronics and Youshang Group have launched a synchronous buck converter solution based on MPS products
Post on Sep 18，2025
ams OSRAM showcases OLED under-display spectral color sensing technology: breaking through environmental constraints, enabling screens to always accurately present the expected display effect
Post on Sep 16，2025
ROHM presents numerous advanced solutions and technologies at PCIM Asia Shanghai 2025
Post on Sep 16，2025
SITWEI launches 50 million pixel 0.7 μ m mobile application CMOS image sensor
Post on Sep 16，2025
Cleaning appliances open, intelligent MCU is the key variable
Post on Sep 16，2025
Cadence expands its digital twin platform library with the NVIDIA DGX SuperPOD model, accelerating the deployment and operation of AI data centers
Post on Sep 11，2025
ADI adopts NVIDIA Jetson Thor platform to promote the development of physical intelligence and reasoning ability of humanoid robots
Post on Sep 11，2025
Toshiba launches 3rd generation 650V SiC MOSFET in TOLL package
