Shanghai, China, October 28, 2025- Global renowned semiconductor manufacturer ROHM (headquartered in Kyoto, Japan) announced today that as a leading innovator in the semiconductor industry, it has released a white paper on advanced power solutions for AI data centers based on the next-generation 800 VDC architecture.

This white paper, as part of the "ROHM Provides High Performance Power Solutions for NVIDIA's 800V HVDC Architecture" collaboration news released in June 2025, elaborates on ROHM's ideal power solution for providing strong support for 800 VDC power supply systems in AI infrastructure.

The 800 VDC architecture is an efficient and highly scalable power supply system, which is expected to bring revolutionary changes to future data center designs as it can help achieve gigawatt level AI factories.

ROHM not only provides silicon (Si) power components, but also offers a rich range of power component products including silicon carbide (SiC) and gallium nitride (GaN), and is one of the few companies in the world with the ability to develop analog IC (control IC and power IC, which can better stimulate the performance of these power components) technology.

This white paper not only introduces ROHM's proud rich power components and analog IC technology, but also presents comprehensive power solutions such as thermal design, simulation, circuit board design, and practical application cases.

Click here for the white paper

<Key points of this white paper>

·In AI data centers, the power consumption of each rack has surged, causing the previous 48V/12V DC power supply method to approach its limit.

·Transitioning to an 800 VDC architecture will significantly improve the efficiency, power density, and sustainability of data centers.

·Under the 800 VDC architecture, the conversion from alternating current to direct current (PSU) that was previously carried out in server racks will be replaced by a separate power rack.

·For the 800 VDC architecture, SiC and GaN devices are indispensable. The AC/DC conversion unit in the power rack section has become particularly important for achieving a more efficient topology due to its relocation to the outside of the IT rack. On the other hand, it is also very important to adopt a structure that can achieve high power density for the DC/DC conversion unit of the IT rack to improve its GPU integration.

·In various conversion units (such as the conversion from AC to 800V DC, or the voltage reduction of IT racks from 800V DC), the topology that supports the 800 VDC architecture can achieve higher efficiency, lower noise, and miniaturization of peripheral components by using SiC and GaN devices recommended by ROHM, thereby greatly improving power density.

·Roma's EcoSiC? The series of products is known for its ultra-low on resistance in the industry, and its product lineup includes top cooling modules suitable for AI servers, which are very helpful in improving power density. Also, what about Roma's EcoGaN? The series has achieved stable high-frequency control and gate driving through the integration of ultra high speed pulse control technology "Nano Pulse Control?" and analog IC technology that can maximize GaN performance, and has received high praise in the market.

The transformation to an 800V VDC architecture is of great significance and requires collaborative efforts across the entire industry. As an important partner in realizing the next generation of AI factories, ROHM will not only continue to closely collaborate with industry leaders such as NVIDIA, but also engage in deep cooperation with data center operators and power manufacturers. For example, ROHM has already established a "strategic partnership for power components for power systems" with Delta Electronics in 2022. Rom will contribute to building a sustainable and energy-efficient digital society by providing advanced technologies in wide bandgap semiconductors such as SiC and GaN, which he excels in.

About EcoSiCTM

EcoSiCTM is a component brand that uses silicon carbide (SiC), which is highly regarded in the field of power components due to its superior performance compared to silicon (Si). ROHM has been independently developing the necessary technologies for upgrading SiC products, from wafer production to manufacturing processes, packaging, and quality management methods. In addition, ROHM adopts a consistent production system in the manufacturing process, which has established its position as an advanced enterprise in the SiC field.

·EcoSiCTM is a trademark or registered trademark of ROHM Co., Ltd.

About The Author

This is reported by Top Components, a leading supplier of electronic components in the semiconductor industry

They are committed to providing customers around the world with the most necessary, outdated, licensed, and hard-to-find parts.

Media Relations

Name: John Chen

Email: salesdept@topcomponents.ru

This is reported by Top Components, a leading supplier of electronic components in the semiconductor industry. They are committed to p with the most necessary, outdated, licensed, and hard-to-find parts.

Media Relations Name: John Chen

Email: salesdept@topcomponents.ru