Beijing, China, August 8, 2025 – Teradyne (NASDAQ:TER), a leading global supplier of automated test equipment and robotics, announced the launch of the Magnum 7H, a next-generation memory test platform designed to meet the stringent testing requirements of high-bandwidth memory (HBM) chips integrated with GPUs and accelerators in high-performance generative AI servers. Designed for large-scale HBM stacked die testing, the Magnum 7H delivers high test throughput, high speed, and high accuracy. Leading HBM manufacturers have begun using Teradyne's Magnum 7H platform for mass production testing and shipment of HBM chips, significantly boosting production capacity.

"We are excited to introduce the Magnum 7H, a revolutionary memory test platform that redefines the standard for testing HBM chips. This innovation marks a significant breakthrough in memory test technology, not only meeting the test needs of current chips but also preparing for future generations," said Young Kim, President of Teradyne's Memory Test Division.

The Magnum 7H is an advanced memory test platform that supports multiple generations of HBM chips, including HBM2E, HBM3, HBM3E, HBM4, and HBM4E. It provides comprehensive coverage, from basic bare die wafer test to memory core test and burn-in test, ensuring high-quality and reliable HBM chips. Furthermore, the Magnum 7H can interface with traditional probe stations and probe cards to test unsawn HBM chips at the Known-Good-Stack-Die (KGSD) or Chip-on-Wafer (CoW) level. It can also be used with a new bare die probe station/handler to test sawn HBM chips to improve chip quality.

Teradyne's Magnum 7H offers the following advantages:

· Improved chip quality: Excellent DPS response time helps improve chip yield.

· Comprehensive memory and logic testing: The Magnum 7H is ideal for testing HBM stacks that combine logic base dies and DRAM dies. Its flexible Algorithmic Test Pattern Generator (APG) supports high-speed memory testing, while a Logic Vector Memory (LVM) option is also available for logic testing. The Fail List Streaming (FLS™) feature ensures real-time error capture during high-speed memory and logic testing.

· High performance: Supporting data rates up to 4.5 Gbps, it meets the speed testing requirements of current HBM3/3E and next-generation HBM4/4E chips.

· High test count: The Magnum 7H is crucial for reducing the overall cost of HBM testing. With a configuration of up to 9,216 digital pins and 2,560 power pins, it significantly improves test efficiency, reduces touch-downs, and increases production throughput by 1.6 times.

The relentless pursuit of higher performance and efficiency in AI and cloud infrastructure applications is driving rapid growth in demand for HBM. Teradyne's Magnum 7H, a next-generation memory test platform, is designed specifically for current and future testing needs of HBM chips. It delivers high test throughput, high speed, and high accuracy, meeting testing requirements at multiple stages throughout the manufacturing process.

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