Renesa Electronics launched 64 bit RZ/G3E MPU, specially designed for high-performance HMI systems requiring AI acceleration and edge computing The all-new MPU integrates a quad core CPU, an NPU, high-speed connectivity, and advanced graphics processing capabilities, Provide support for next-generation HMI devices equipped with full HD displays On July 29, 2025, Beijing, China - Renesas Electronics (TSE: 6723), a global semiconductor solutions provider, announced today the launch of its new 64 bit microprocessor RZ/G3E (MPU). As a general-purpose product, RZ/G3E is optimized for high-performance human-machine interface (HMI) applications, integrating a quad core Arm Cortex-A55 with a running frequency of up to 1.8GHz and a neural network processing unit (NPU), which can achieve high-performance edge computing and have AI reasoning functions, thus bringing faster and more efficient local processing. With its full HD graphics processing capability and high-speed connectivity, this MPU is primarily designed for HMI systems in the industrial and consumer sectors, including factory equipment, medical monitors, retail terminals, and building automation systems. RZ/G3E MPU equipped with quad core CPU and NPU enables advanced processing of edge computing. jpg High performance edge computing and HMI functions The core of RZ/G3E includes a quad core Arm Cortex-A55, a Cortex-M33 core, and an EthosTM-U55 NPU for AI tasks. This architecture can efficiently run AI applications such as image classification, object recognition, speech recognition, and anomaly detection, while minimizing CPU load. This product is designed specifically for HMI applications and can smoothly play full HD (1920x1080) videos at a rate of 60fps on two independent displays. Its output interfaces include LVDS (dual link), MIPI-DSI, and parallel RGB interfaces; In addition, RZ/G3E is equipped with MIPI-CSI camera interface, which can be used for video input and perception applications. Renesas RZ/G Series HMI Product Lineup. jpg Daryl Khoo, Vice President of Embedded Processing at Renesas, stated that "RZ/G3E has added NPU to support AI processing based on the mature performance of the RZ/G series. By using the same EthosTM-U55 NPU as our recently released RA8P1 microcontroller, we have provided a scalable path for AI development. These enhanced features, with their powerful AI capabilities, meet the needs of next-generation HMI applications in visual, speech, and real-time analysis. ” The RZ/G3E is equipped with a range of high-speed communication interfaces required for edge devices, including PCI Express 3.0 (2-channel) for up to 8Gbps data transfer, USB 3.2 Gen2 for fast 10Gbps data transfer, and dual channel Gigabit Ethernet for seamless connection with cloud services, storage devices, and 5G modules. Low power standby and fast Linux recovery Starting from the third generation RZ/G3S, the RZ/G series includes advanced power management functions that can significantly reduce standby power consumption. The RZ/G3E can maintain sub CPU operation and peripheral functionality while consuming as low as approximately 50mW of power; in deep standby mode, the power consumption is approximately 1mW. It supports DDR self refresh mode to preserve memory data, allowing for quick wake-up and running of Linux applications from deep standby mode. Comprehensive Linux software support Renesas offers validated Linux software packages (VLPs) based on a reliable Civil Infrastructure Platform kernel, with over 10 years of maintenance support. For users who require the latest version, Renesas offers Linux BSP Plus, which supports the latest LTS Linux kernel and Yocto. In addition, Canonical's Ubuntu and Debian open-source operating systems can also be used for server or desktop Linux environments. Key characteristics of RZ/G3E ·CPU: quad core Cortex-A55 (up to 1.8GHz), Cortex-M33 · NPU：EthosTM-U55（512GOPS） ·HMI: Dual Full HD output, MIPI-DSI/Dual link LVDS/Parallel RGB, 3D graphics processing, H.264/H.265 codec ·Memory interface: 32-bit LPDDR4/LPDDR4X (with ECC) ·5G communication connection: PCIe 3.0 (2-channel) USB 3.2 Gen2、USB 2.0 x2、 Gigabit Ethernet x2, CAN-FD ·Working temperature: -40 ° C to 125 ° C ·Package options: 15mm2 529 pin FCBGA, 21mm2 625 pin FCBGA ·Product Lifecycle: Provide a 15 year supply guarantee according to the Product Lifecycle Plan (PLP) System level module solutions launched by Renesas and its ecosystem partners Rexa also launched a modular system (SoM) solution based on RZ/G3E - high-performance edge computing SoM | Rexa. Renesas' ecosystem partners will offer a wide range of SoM solutions, such as Tria's SMARC module, ARIES Embedded's OSM (Size-M specification), and MXT's OSM (Size-L specification). This is reported by Top Components, a leading supplier of electronic components in the semiconductor industry They are committed to providing customers around the world with the most necessary, outdated, licensed, and hard-to-find parts. Media Relations Name: John Chen Email: salesdept@topcomponents.ru