Single core and dual core MCU combined with Arm Cortex-M85 and M33 cores

Arm Ethos-U55 NPU， Achieve outstanding AI performance of up to 256 GOPS

Dual Arm CPU cores achieve unprecedented 7300+CoreMark (note)

TSMC's 22ULL process brings high performance and low power consumption

Embedded MRAM has faster write speed, stronger durability, and data retention capability

Specialized peripherals optimized for visual and voice AI, as well as real-time analysis

New AI software framework simplifies development and supports easy migration with MPU

Excellent security features ensure data privacy

On July 2, 2025, Beijing, China - Renesas Electronics (TSE: 6723), a global semiconductor solutions provider, announced today the launch of its RA8P1 microcontroller (MCU) product line for artificial intelligence (AI), machine learning (ML) applications, and real-time analysis. This series of MCUs sets a new benchmark for MCU performance by combining 1GHz Arm Cortex-M85 and 250MHz Cortex-M33 CPU cores with Arm EthosTM-U55 Neural Processing Unit (NPU). This combination can achieve the highest CPU performance of over 7300 CoreMark and AI performance of 256 GOPS at 500 MHz.

Specially designed for edge/terminal AI

RA8P1 is optimized for edge AI applications, utilizing Ethos-U55 NPU to offload CPU's computationally intensive operations in Convolutional Neural Networks (CNN) and Recurrent Neural Networks (RNN), achieving performance of up to 256 MAC per cycle and up to 256 GOPS at 500MHz. The new NPU supports most commonly used neural networks, including DS-CNN, ResNet, Mobilenet TinyYolo, etc. According to the different neural networks used, Ethos-U55 can achieve up to 35 times the number of inferences per second compared to the Cortex-M85 processor used alone.

advanced technique

The RA8P1 MCU is manufactured using TSMC's 22ULL (22nm ultra low leakage) process, which achieves ultra-high performance while maintaining extremely low power consumption. This process also supports the integration of embedded magnetic random access memory (MRAM) in the new MCU. Compared to flash memory, MRAM has faster write speeds, higher durability, and stronger data retention capabilities.

Daryl Khoo, Vice President of Embedded Processing Marketing Division at Renesas, stated that the demand for high-performance edge AIoT applications is exploding, and RA8P1 is the MCU product we have launched to address this trend. It not only fully demonstrates our profound accumulation in technology and market fields, but also reflects the extensive cooperation ecosystem we have established with industry partners. Renesas' customers have shown a strong willingness to deploy this new MCU in diverse AI scenarios. ”

Paul Williamson, Senior Vice President and general manager, IoT Line of Business at Arm The pace of innovation in the era of artificial intelligence is faster than ever before, and new edge applications have raised higher requirements for device performance and machine learning. The Renesas RA8P1 MCU, relying on the advanced AI capabilities of the Arm computing platform, can meet the needs of the next generation of voice and visual applications, helping to expand intelligent and context aware AI experiences. ”

Chien-Hsin Lee, Senior Director of Specialty Technology Business Development at TSMC We are delighted to see Renesas fully utilizing the performance and reliability of TSMC's 22ULL embedded MRAM technology to bring outstanding results to its RA8P1. As TSMC continues to advance embedded non-volatile memory (eNVM) technology, we look forward to strengthening our long-term cooperation with Renesas to jointly drive innovation in future breakthrough products. ”

Rich peripherals designed specifically for AI

The RA8P1 launched by Renesas integrates dedicated peripherals, ample memory, and advanced security features to support voice and visual AI as well as real-time analysis applications. For visual AI, the device includes a 16 bit camera interface (CEU) that supports image sensors up to 5 million pixels, enabling visual AI applications that require access to cameras and high computing power. The independent MIPI CSI-2 interface provides a low pin count interface with two channels: each channel can reach a maximum speed of 720Mbps. In addition, multiple audio interfaces (including I2S and PDM) support microphone input to meet the needs of voice AI applications.

RA8P1 integrates on-chip storage and scalable external storage to achieve efficient and low latency neural network processing. The MCU is equipped with 2MB SRAM for storing intermediate variables or buffers. In addition, the product is equipped with 1MB on-chip MRAM for storing application code, model weights, or graphic resources. For larger scale models, high-speed external memory interfaces can be provided. For more demanding AI application requirements, this MCU also offers SIP options with a single package containing 4MB or 8MB external flash memory.

New RUHMI Framework

Along with the RA8P1 MCU, there is also Renesas RUHMI (Renesas Unified Heterogeneous Model Integration). As a comprehensive AI compiler and framework for MCU and MPU, RUHMI provides efficient AI tools that can deploy various latest neural network models. It supports model optimization, quantization, graph compilation, and transformation, and generates efficient and MCU compatible source code. RUHMI natively supports machine learning AI development frameworks such as TensorFlow Lite, Pytorch, and ONNX, and also provides tools for deploying pre trained neural networks API、 Code generator and runtime environment, including demonstration cases for RA8P1. In addition, the integration of RUHMI with Renesas' own e2Studio IDE enables seamless AI development, providing a universal development platform for MCUs and MPUs.

Advanced security features

RA8P1 MCU builds cutting-edge security for critical applications. The new Renesas Security IP (RSIP-E50D) integrates numerous encryption accelerators, including CHACHA20, Ed25519, NIST ECC curve up to 521 bits, enhanced RSA up to 4K, SHA2, and SHA3. Working in conjunction with Arm TrustZone, this IP can achieve comprehensive and fully integrated security element like functionality. The new MCU also features a powerful hardware trust root and a secure boot function implemented in immutable memory (ROM) through the first stage bootloader (FSBL). The XSPI interface that supports real-time decryption (DOTF) allows encrypted code programs to be stored in external flash memory and decrypted in real-time when securely transmitted to the MCU for execution.

Ready to use solution

Renesas has developed a range of user-friendly tools and solutions for the RA8P1 MCU, including the Flexible Software Package (FSP), evaluation kits, and development tools, supporting FreeRTOS, Azure RTOS, and Zephyr. Renesas also provides multiple software example projects and application instructions to help customers accelerate product launch speed. In addition, numerous partner solutions can also support the development of RA8P1 MCU, including driver monitoring solutions from Nota.AI and traffic/pedestrian monitoring solutions from Irida Labs. For more solutions, please refer to the RA Partner Ecosystem Solutions.

Key features of RA8P1 MCU

Processor: 1GHz Arm Cortex-M85, 500MHz Ethos-U55, 250MHz Arm Cortex-M33 (optional)

Storage: 1MB/512KB on-chip MRAM, 4MB/8MB external flash SIP option, 2MB fully ECC protected SRAM, 32KB I/D cache per core

Graphics peripherals: graphics LCD controller supporting up to WXGA (1280x800) resolution, parallel RGB and MIPI-DSI display interfaces, powerful 2D graphics engine, parallel 16 bit CEU and MIPI CSI-2 camera interfaces, 32-bit external memory bus (SDRAM and CSC) interfaces

Other peripherals: Gigabit Ethernet and TSN switches, XSPI (eight wire SPI) with XIP and DOTF, SPI, I2C/I3C, SDHI, USBFS/HS, CAN-FD, PDM and SSI audio interfaces, 16 bit ADC with S/H circuit, DAC, comparator, temperature sensor, timer

Security features: Advanced RSIP-E50D encryption engine TrustZone、 Immutable memory, secure boot, tamper proof, DPA/SPA attack protection, secure debugging, secure factory programming, device lifecycle management

Packaging: 224BGA, 289BGA

This is reported by Top Components, a leading supplier of electronic components in the semiconductor industry

They are committed to providing customers around the world with the most necessary, outdated, licensed, and hard-to-find parts.

Media Relations

Name: John Chen

Email: salesdept@topcomponents.ru