On July 2, 2025, the international leading semiconductor component distributor dedicated to the Asia Pacific market, Dalianda Holdings, announced that its Worldpin launched a HVBMS BJB scheme with NXP MC33772C lithium-ion battery controller IC as the core, and Toshiba optical relay TLX9160T, onsemi EEPROM chip NV24C64LV, Vishay battery shunt WSBS8518 and Molex connector 43650-0213 as peripheral devices.

In the context of accelerating the transformation of the new energy vehicle industry to electrification and intelligence, the battery management system (BMS) is upgrading towards high-precision monitoring and modular architecture. As a safety control hub in BMS, HVBMS BJB (High Voltage Battery Management System Battery Junction Box) undertakes core responsibilities such as real-time monitoring of battery status, fault diagnosis and protection control, which is critical to vehicle battery safety. According to the design requirements of BMS, DaLian DaShiPing launched the HVBMS BJB scheme with NXP MC33772C lithium-ion battery controller IC as the core, supplemented by TOSHIBA optical relay TLX9160T, Ansemy onsemi EEPROM chip NV24C64LV, Vishay battery shunt WSBS8518 and Molex connector 43650-0213 as peripheral devices.

MC33772C is a lithium-ion battery controller IC for automotive and industrial control applications such as HEV, EV, ESS and UPS systems. It meets AEC-Q100 standards, can be hot swapped, supports ISO 26262 standards, and has a safety level up to ASIL D. The device provides a variety of advanced voltage and temperature measurement functions, with embedded balance transistors and rich diagnostic functions, which simplifies the BJB application design. In terms of communication, MC33772C has a SPI interface up to 4Mbit/s, and the chip uses TPL2 protocol to achieve 2Mbps isolated communication, support transformer and capacitor isolation, and ensure the reliability and anti-interference ability of data transmission.

In terms of device design, MC33772C chip is packaged with HLQFP48 and has 7 GPIOs, which can be configured as input or output mode according to requirements. In addition, the chip also integrates ADC (Analog to Digital Converter) sampling pins. By combining the use of Cell pins, up to 8 GPIOs can be provided as the sampling input of ADC to flexibly meet the needs of diverse application scenarios.

In terms of connectors, this solution supports battery pack high-voltage detection line, TPL communication line, 12V power supply line, and external NTC connection line. Users can connect the corresponding harness to achieve BJB function. In addition, the single board of this scheme can support 400V voltage detection. Users can flexibly use one or two boards to build 400V/800V voltage systems according to actual needs, fully meeting the application needs of different models and high-voltage platforms.

Core technical advantages:

? MC33772C has a rich number of channels: 0/1/3~6 channels to meet the needs of different users;

? It has 8 high-precision GPIO (including one cell pin) as ADC sampling input, and the nominal error of the chip is 0.8mV;

? Voltage overvoltage (OV) and undervoltage (UV) threshold settings can be configured to support fault diagnosis and processing;

? Internal includes two redundant temperature sensors and external two temperature detection: Shunt temperature detection and external temperature detection interfaces;

? Wide operating voltage: normal operation can be ensured within 5V~30V (chip power supply 5V supports SPI communication, 7V supports TPL communication);

? It has I2C master device interface and can control off chip EEPROM and other slave devices;

? Support 2Mbit/s TPL communication.

Scheme specification:

? Support TPL communication up to 2Mbps;

? Support 7-way high voltage detection (HV_DC ±, HV_CH ±, HV_BAT ±, redundancy detection HV_DC+), with accuracy of ± 1% (≥ 500V, national standard), ± 5% (＜ 500V, national standard);

? Support current detection (two pieces of AFE support redundant detection), with accuracy of 2% (<200A, national standard), 1% (≥ 200A, national standard);

? Support 1-circuit insulation detection acquisition resistance;

? Support two temperature detection: detect PreCHG temperature and Shunt temperature;

? Support 6-way IO control optocoupler relay TLX9160T;

? The AFE between boards is isolated by transformer.

This news is mainly from Dadatong:

Based on NXP MC33772C Auto HVBMS BJB scheme

About Grand Alliance Holdings:

Dalianda Holdings is an international leading semiconductor component distributor dedicated to the Asia Pacific market. Founded in 2005, it celebrates its 20th anniversary this year. Headquartered in Taipei, it has about 5000 employees, more than 250 agent product suppliers, 69 service centers around the world, and a turnover of NT $880.55 billion in 2024. Great United University has created an industrial holding platform, focused on international operation scale and local flexibility, and has been deeply rooted in the Asia Pacific market for a long time. With the vision of "industry's preferred channel benchmark", it has comprehensively implemented the core values of "team, integrity, professionalism, and efficiency". It has won the recognition of "Global Distributor Excellence Award" for 24 consecutive years, and has been continuously committed to strengthening the sustainable development of ESG. For three consecutive years, it has won international recognition and MSCI ESG rating A award. Faced with the new manufacturing trend, the University is committed to transforming itself into a data driven enterprise, building an online digital platform - "Dada Network", and advocating the mode of intelligent logistics service (LaaS, Logistics as a Service) to help customers jointly face the challenges of intelligent manufacturing. The General Assembly, proceeding from good intentions, builds trust with technology, and takes "creating partner values to achieve the future" as its corporate purpose, hoping to build a big competitive ecosystem with the industry "Rabbang".

This is reported by Top Components, a leading supplier of electronic components in the semiconductor industry

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