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ROHM and Xinchi Technology jointly developed the reference design for the vehicle SoC X9SP, equipped with ROHM's PMIC for SoC, to assist in the development of smart seats

Post on Jan 01,1970

Shanghai, China, June 25, 2025- Global renowned semiconductor manufacturer ROHM (headquartered in Kyoto, Japan) announced today that it has jointly developed the reference design "REF68003" for intelligent cockpits with leading automotive chip company Xinchi Technology. This reference design mainly covers Xinchi Technology's intelligent cockpit SoC * 1 "X9SP" product, which is equipped with ROHM's PMIC * 2 product and was showcased at the Xinchi Technology booth at the 2025 Shanghai Auto Show.

Xinchi Technology's X9 series products comprehensively cover instruments IVI、 The cabin domain control, cabin docking integration and other cabin application scenarios from entry-level to flagship level have been shipped in the order of millions of pieces, with rich experience in mass production and mature ecology. According to the latest data from Gaishi Automotive Research Institute (domestic passenger car insurance coverage), from January to March 2025, among car models priced at over 100000 yuan, Xinchi Technology's X9 series cockpit chips (including instruments, central control, and domain control) ranked first in the local market, covering more than 50 mainstream car models from SAIC, Chery, Changan, FAW, GAC, BAIC, Dongfeng Nissan, Dongfeng Honda and a large number of models going overseas.

Xinchi Technology and ROHM began technical exchanges in 2019 and have been committed to collaborating on the development of intelligent cockpit applications. In 2022, both parties signed a cooperation agreement on advanced technology development in the field of automotive. So far, both parties have jointly developed reference designs for intelligent cockpits by combining Xinchi Technology's in car SoCs "X9H", "X9M", and "X9E", as well as ROHM's PMIC, SerDes IC * 3, and LED driver IC

In 2025, for mid to high end intelligent cockpits, Xinchi Technology and ROHM jointly developed a new reference design "REF68003" based on the in car SoC "X9SP". ROHM provides PMICs "BD96811F44-C", "BD96806Q04-C", "BD96806Q05-C" and "BD96806Q06-C" for SoC, which comply with ISO 26262 and ASIL-B * 4, helping to achieve various high-performance in car applications. In the future, ROHM will continue to develop products suitable for automotive infotainment systems, contributing to improving the convenience and safety of automobiles.


Sun Mingle, CTO of Xinchi Technology, said: "With the rapid development of automotive intelligence, the requirements for automotive electronics and components are also increasing. X9SP is the core flagship product of Xinchi X9 series high-performance cabin SoC, designed for intelligent cabin and cross domain integration scenarios, with high performance and reliability, especially suitable for cabin parking integrated solutions. The newly developed reference design combines ROHM's PMIC with X9SP to improve the overall system stability and energy efficiency. We look forward to continuing our collaboration with ROHM to provide various innovative in car solutions in the future.


We are delighted to collaborate with Xinchi Technology, a leading company in the automotive SoC field, to develop a new reference design, "said Tetsuo Kishi, Senior Executive Officer of ROHM. The intelligent cockpit integrating various functions such as information entertainment and ADAS monitoring is accelerating its popularity, especially in the next generation of electric vehicles, where the role of on-board analog semiconductor products such as PMIC is becoming increasingly important. The PMIC provided by ROHM for SoC this time is a power IC that can be flexibly applied to the new generation of car power supplies and meet functional safety requirements. In the future, by continuing to deepen communication and cooperation with Xinchi Technology, ROHM will accelerate the development of products that support the multifunctional development of the next generation of intelligent cockpits, and contribute to the further development of the automotive industry. ”


<Background>


In recent years, the popularity of intelligent cockpits has accelerated the adoption of large displays, in addition to various functions such as instrument clusters and information entertainment systems. At the same time, the processing power required for in vehicle SoCs is also increasing, thus requiring power ICs such as PMICs as core components to undertake power supply while supporting current and efficient operation.


ROHM provides PMIC for SoC, which not only has high stability and efficiency, but also allows for arbitrary output voltage setting and sequence control through internal memory (OTP). By minimizing circuit changes, power systems can be built for various vehicle models and models, contributing to reducing development time for automotive manufacturers.

Regarding the reference design "REF68003" equipped with "X9SP" and ROHM products


The "REF68003" is equipped with Xinchi Technology's intelligent cockpit SoC "X9SP" and ROHM's SoC PMIC. At present, the reference design has been validated by Xinchi Technology. By utilizing this reference design, an intelligent cockpit that achieves safety level ASIL-B can be realized. In addition, the SoC provided by ROHM uses PMIC, which can use internal memory (OTP) for arbitrary output voltage setting and timing control, thus enabling efficient and flexible power supply according to specific circuit requirements.


This reference design utilizes Xinchi Technology's proprietary hardware virtualization support function, which supports running multiple operating systems (OSs) on a single SoC. Meanwhile, by utilizing the hardware security management module, commands from the OS can also be passed to the SoC and GPU. In addition, by replacing with other pin compatible SoCs from Xinchi Technology, specifications can be quickly changed without changing the circuit.


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About Xinchi Technology's Intelligent Cockpit SoC "X9SP Series"


https://www.semidrive.com/product/X9SP


Regarding the reference design page for Rom


Detailed information about the reference design and the products included in it has been published on the official website of ROHM.


URL: https://www.rohm.com.cn/reference-designs/ref68003


For more detailed information about the reference design, please contact us through the sales representative or the "Contact Us" page on the Roma official website.


 


About Xinchi Technology


Xinchi Technology is a leader in all scenario intelligent vehicle chips, focusing on providing high-performance and highly reliable automotive grade chips, covering the fields of intelligent cockpit and intelligent vehicle control, and covering the most core chip categories of future automotive electronic and electrical architecture. The entire series of chips from Xinchi have been mass-produced, with a shipment volume of over 8 million pieces. Xinchi currently has over 200 designated projects, serving more than 260 customers, covering more than 90% of domestic OEMs and some international mainstream car companies, including SAIC, Chery, Changan, Dongfeng, FAW, Nissan, Honda, Volkswagen, Ideal, etc. For further details, please visit the official website of Xinchi Technology: https://www.semidrive.com/


 


Regarding Roma


ROHM is a semiconductor electronic component manufacturer founded in 1958. By establishing a global development and sales network, we provide high-quality and highly reliable IC, discrete semiconductor, and electronic component products for the automotive and industrial equipment markets, as well as numerous markets such as consumer electronics and communications. In the fields of power electronics and simulation that ROHM excels in, ROHM's advantage lies in providing optimized solutions for the overall system, including silicon carbide power components and driver ICs that fully utilize their performance, as well as peripheral components such as transistors, diodes, resistors, etc. For more information, please visit the official website of Roma: https://www.rohm.com.cn/ <Terminology Explanation>


*1) SoC (System-On-a-Chip: System on Chip)


An integrated circuit that incorporates a CPU (central processing unit), memory, interfaces, and other components. In order to achieve high processing capacity, power efficiency, and space reduction, it is widely used in the fields of vehicle mounted equipment, household equipment, and industrial equipment.


*2) PMIC (Power Management IC)


An IC that contains multiple power systems and integrates power management and timing control functions on a single chip. Compared with circuit structures that use DC-DC converter ICs, LDOs, and discrete components alone, it can significantly save space and shorten development cycles. Therefore, in recent years, it has become a commonly used component in applications with multiple power systems, whether in the field of automotive devices or consumer electronics.


*3) SerDes IC


The general term for two ICs used in pairs for high-speed data transmission and for communication mode conversion. A deserializer is used to convert data into a format that is easy to transmit at high speeds (converting parallel data into serial data), while a deserializer is used to convert transmitted data into its original format (converting serial data into parallel data).


*4) ISO 26262、ASIL(Automotive Safety Integrity Level)


ISO 26262 is an international standard related to functional safety of automotive electronic and electrical systems, officially promulgated and implemented in November 2011. It is a standardized development process aimed at achieving 'functional safety'. It is necessary to calculate the fault risk in the on-board electronic control and embed the mechanism to reduce its risk as one of the functions in the system in advance. This standard covers from the vehicle concept stage to the system ECU、 The entire lifecycle of vehicle development, including embedded software, device development, production, maintenance, and scrapping stages. ASIL is a risk classification system defined in ISO 26262, which is divided into four levels. The higher the risk level, the higher the requirements for functional safety.

This is reported by Top Components, a leading supplier of electronic components in the semiconductor industry


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Media Relations


Name: John Chen


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